Tinning the bit.                   Heating the joint and applying the solder

Use a damp sponge, frequently, to keep the bit clean.

Tin the bit for good heat conduction.(This means putting a small blob of solder on the tip of the bit).

Hold the iron like a pen.

Rest your hands on the workbench to steady them.

Take precautions against the work moving. (use a small vice or sticky tape).

Heat the biggest part of the joint for 2-3 seconds.
Apply solder to the joint not to the iron.
Allow the solder to run over the joint without moving the iron.
Remove the solder.
Remove the iron.
Avoid overheating.The process should take only 2-3 seconds.

A dry joint is a poorly soldered one.
A good joint is smooth and shiny.
If the joint has moved during soldering it will be dull and crinkly.
If you have taken too long it will have have solder spikes.

The shape of the wire should be visible through the solder.

All soldered joints should be easily removable.This means a minimum of lead wrapping.
When using printed circuit boards avoid bending wires flat on the board. It makes them difficult to remove.
Spring component leads out just slightly, to prevent them falling out during soldering.

Mount components so that value markings are visible.

Do not carry solder on the bit to the joint. The smoke you see is evaporating flux, which should normally clean the joint.

Reflow soldering is tinning two pieces of wire separately and then reheating to join them together.

There are some exercises on this web site. If you can do them well then your soldering is ok.

PRACTICE MAKES PERFECT !!!